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Technical Sponsors

Dear Collegues,

We cordially invite you to attend and submit your papers for the 2nd International Congress of Electrical and Computer Engineering (ICECENG'2023), which will be organized by Electrical and Electronics Engineering Department of Bandirma Onyedi Eylul University on 22-25 November  2023.

ICECENG'23 is technically sponsored by Springer/EAI.

ICECENG'23 is an international congress the first of which was held in 2022, is aimed at providing an exceptional platform for researchers, professionals, students, engineers and scientists from academia and industry to exchange the latest research ideas, methods, results, and share experiences, on all theoretical, experimental and applied aspects of Computing and Communication studies.

Submissions of full text papers are invited. All papers that are submitted to our congress will be peer- reviewed. 

Technical papers are invited on the Communication and Informatics topics pertaining to the scope of the congress, which include but are not limited to:

  - Computing

  - Communication

  - Artificial Intelligence​​

  - Informatics

The detailed topics can be found on topic section.

After peer-review, ALL Accepted and Registered full text-papers  will be published in Springer/EAI Springer Innovations in Communication and Computing book series.

EAI/Springer Innovations in Communication and Computing will be submitted for inclusion in leading indexing services, such as Compendex, Scopus, DBLP, EU Digital Library, Google Scholar, IO-Port, MathSciNet, Inspec, and Zentralblatt MATH.​

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